| dc.contributor.author | Zarketa-Astigarraga, Ander | |
| dc.contributor.author | Martinez Agirre, Manex | |
| dc.contributor.author | Martin-Mayor, Alain | |
| dc.contributor.author | Bou-Ali, M. Mounir | |
| dc.contributor.other | Tijero, M. | |
| dc.contributor.other | Aranburu, I. | |
| dc.contributor.other | Arriola, A. | |
| dc.contributor.other | Díez, V. | |
| dc.contributor.other | Elizalde, J. | |
| dc.contributor.other | Eguiluz, X. | |
| dc.date.accessioned | 2022-10-31T09:25:48Z | |
| dc.date.available | 2022-10-31T09:25:48Z | |
| dc.date.issued | 2017 | |
| dc.identifier.isbn | 9781509010127 | en |
| dc.identifier.other | https://katalogoa.mondragon.edu/janium-bin/janium_login_opac.pl?find&ficha_no=148233 | en |
| dc.identifier.uri | https://hdl.handle.net/20.500.11984/5783 | |
| dc.description.abstract | This paper describes a smart system to monitor high temperature in industrial applications. The solution includes a semipassive microchip which allows logging data and wireless reading. Protection for the electronics against high temperature environment is provided by a vacuum packaging. Thermal isolation at 150°C and 800°C ambient temperature allows the system to work properly during 14 and 2 minutes respectively. | en |
| dc.description.sponsorship | Gobierno Vasco-Eusko Jaurlaritza | es |
| dc.language.iso | eng | en |
| dc.rights | © 2017 IEEE | en |
| dc.subject | Packaging | en |
| dc.subject | Wireless communication | en |
| dc.subject | Temperature sensors | en |
| dc.subject | Wireless sensor networks | en |
| dc.subject | temperature measurement | en |
| dc.subject | Monitoring | en |
| dc.subject | Antennas | en |
| dc.title | Vacuum packaging and semipassive chips for wireless temperature monitoring in industrial applications | en |
| dcterms.accessRights | http://purl.org/coar/access_right/c_abf2 | en |
| dcterms.source | 2017 IEEE SENSORS Conference Proceedings | en |
| local.contributor.group | Mecánica de fluidos | es |
| local.description.peerreviewed | true | en |
| local.identifier.doi | http://dx.doi.org/10.1109/ICSENS.2017.8234235 | en |
| local.relation.projectID | info:eu-repo/grantAgreement/GV/Elkartek 2016/KK-2016-00030/CAPV/Microtecnologías como motor de desarrollo de sistemas ciber-físicos avanzados involucrados en la fábrica inteligente/MICRO4FAB | en |
| local.contributor.otherinstitution | https://ror.org/03hp1m080 | es |
| local.source.details | Glasgow. 29 October-1 November, 2017. IEEE, 2017 | en |
| oaire.format.mimetype | application/pdf | |
| oaire.file | $DSPACE\assetstore | |
| oaire.resourceType | http://purl.org/coar/resource_type/c_c94f | en |
| oaire.version | http://purl.org/coar/version/c_ab4af688f83e57aa | en |
