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dc.contributor.authorZarketa-Astigarraga, Ander
dc.contributor.authorMartinez Agirre, Manex
dc.contributor.authorMartin-Mayor, Alain
dc.contributor.authorBou-Ali, M. Mounir
dc.contributor.otherTijero, M.
dc.contributor.otherAranburu, I.
dc.contributor.otherArriola, A.
dc.contributor.otherDíez, V.
dc.contributor.otherElizalde, J.
dc.contributor.otherEguiluz, X.
dc.date.accessioned2022-10-31T09:25:48Z
dc.date.available2022-10-31T09:25:48Z
dc.date.issued2017
dc.identifier.isbn9781509010127en
dc.identifier.otherhttps://katalogoa.mondragon.edu/janium-bin/janium_login_opac.pl?find&ficha_no=148233en
dc.identifier.urihttps://hdl.handle.net/20.500.11984/5783
dc.description.abstractThis paper describes a smart system to monitor high temperature in industrial applications. The solution includes a semipassive microchip which allows logging data and wireless reading. Protection for the electronics against high temperature environment is provided by a vacuum packaging. Thermal isolation at 150°C and 800°C ambient temperature allows the system to work properly during 14 and 2 minutes respectively.en
dc.description.sponsorshipGobierno Vasco-Eusko Jaurlaritzaes
dc.language.isoengen
dc.rights© 2017 IEEEen
dc.subjectPackagingen
dc.subjectWireless communicationen
dc.subjectTemperature sensorsen
dc.subjectWireless sensor networksen
dc.subjecttemperature measurementen
dc.subjectMonitoringen
dc.subjectAntennasen
dc.titleVacuum packaging and semipassive chips for wireless temperature monitoring in industrial applicationsen
dcterms.accessRightshttp://purl.org/coar/access_right/c_abf2en
dcterms.source2017 IEEE SENSORS Conference Proceedingsen
local.contributor.groupMecánica de fluidoses
local.description.peerreviewedtrueen
local.identifier.doihttp://dx.doi.org/10.1109/ICSENS.2017.8234235en
local.relation.projectIDinfo:eu-repo/grantAgreement/GV/Elkartek 2016/KK-2016-00030/CAPV/Microtecnologías como motor de desarrollo de sistemas ciber-físicos avanzados involucrados en la fábrica inteligente/MICRO4FABen
local.contributor.otherinstitutionhttps://ror.org/03hp1m080es
local.source.detailsGlasgow. 29 October-1 November, 2017. IEEE, 2017en
oaire.format.mimetypeapplication/pdf
oaire.file$DSPACE\assetstore
oaire.resourceTypehttp://purl.org/coar/resource_type/c_c94fen
oaire.versionhttp://purl.org/coar/version/c_ab4af688f83e57aaen


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Registro sencillo