Título
Vacuum packaging and semipassive chips for wireless temperature monitoring in industrial applicationsOtras instituciones
IkerlanVersión
Postprint
Derechos
© 2017 IEEEAcceso
Acceso abiertoVersión del editor
http://dx.doi.org/10.1109/ICSENS.2017.8234235Publicado en
2017 IEEE SENSORS Conference Proceedings Glasgow. 29 October-1 November, 2017. IEEE, 2017Palabras clave
Packaging
Wireless communication
Temperature sensors
Wireless sensor networks ... [+]
Wireless communication
Temperature sensors
Wireless sensor networks ... [+]
Packaging
Wireless communication
Temperature sensors
Wireless sensor networks
temperature measurement
Monitoring
Antennas [-]
Wireless communication
Temperature sensors
Wireless sensor networks
temperature measurement
Monitoring
Antennas [-]
Resumen
This paper describes a smart system to monitor high temperature in industrial applications. The solution includes a semipassive microchip which allows logging data and wireless reading. Protection for ... [+]
This paper describes a smart system to monitor high temperature in industrial applications. The solution includes a semipassive microchip which allows logging data and wireless reading. Protection for the electronics against high temperature environment is provided by a vacuum packaging. Thermal isolation at 150°C and 800°C ambient temperature allows the system to work properly during 14 and 2 minutes respectively. [-]
Sponsorship
Gobierno Vasco-Eusko JaurlaritzaID Proyecto
info:eu-repo/grantAgreement/GV/Elkartek 2016/KK-2016-00030/CAPV/Microtecnologías como motor de desarrollo de sistemas ciber-físicos avanzados involucrados en la fábrica inteligente/MICRO4FABColecciones
- Congresos - Ingeniería [374]