Bilatu
24-tik 1-10 emaitza erakusten
Simple voltage balancing method to protect series-connected devices experimentally verified in a 5L-MPC converter
(IEEE, 2018)
This paper presents a solution for the voltage balance problem of the series-connected devices that can be applied to multilevel converters in which the series-connected devices need to block twice their switched voltage. ...
Medium voltage-high power converter topologies comparison procedure for a 6.6kV Drive Application using 4.5kV IGBT Modules
(IEEE, 2012)
This paper presents a general comparison procedure for medium voltage - high power multilevel converter topologies and semiconductors, which is mainly based on analyzing the performance limits of the converters output ...
Design of a Solid-State Circuit Breaker for a DC Grid-Based Vessel Power System
(MDPI, 2019)
Electric propulsion and integrated hybrid power systems can improve the energy efficiency
and fuel consumption of different kinds of vessels. If the vessel power system is based on DC grid
distribution, some benefits ...
Gallium Nitride Power Devices: A State of the Art Review
(IEEE, 2023)
Wide Bandgap (WBG) semiconductor materials present promising electrical and thermal characteristics for Power Electronics applications. These WBG devices make it possible the development of more efficient converters with ...
Time-Frequency Analysis of Experimental Measurements for the Determination of EMI Noise Generators in Power Converters
(MDPI, 2022)
In the context of recent decades in which there has been great development in power electronics systems with increasingly better operating characteristics, the study of the factors that affect the behaviour of these systems ...
Review of Wide Bandgap Materials and their Impact in New Power Devices
(IEEE, 2017)
Power electronic converters use semiconductors to satisfy the needs of different applications. Nowadays, these semiconductors are mainly based on Silicon (Si), which can be processed virtually without defects. However, the ...
Time saving analytical modelling and design of PCBS with through-hole and blind thermal vias
(IET, 2025)
High-power-density converters concentrate heat in smaller areas of printed circuit boards (PCBs), a challenge exacerbated by Gallium Nitride (GaN)-based components in surface-mount device (SMD) packages. While these ...
Static Current Unbalance of Paralleled SiC MOSFET Modules in the Final Layout
(IEEE, 2020)
Silicon Carbide (SiC) MOSFETs enable enhanced performance of power converters in several applications. Parallel connection of SiC MOSFETs become mandatory for medium power applications due to the current rate of existing ...
Suitability analysis, design and protection of an active modular rectifier architecture for a more electric aircraft
(Mondragon Unibertsitatea. Goi Eskola Politeknikoa, 2022)
Aiming to reduce the pollution caused by the traditional aircraft, strong research efforts are done towards the aircraft electrification to reduce the fuel usage. Thus, high efficiency, high power density and high reliability ...
Steady-state temperature calculation tool for multilayer PCBs
(IEEE, 2025)
The adoption of GaN-based devices in power converters offers significant improvements in efficiency and power density, but also intensifies thermal challenges by concentrating heat in smaller volumes. High current and ...
