Vacuum packaging and semipassive chips for wireless temperature monitoring in industrial applications

dc.creator	Tijero, M.
dc.creator	Eguiluz, X.
dc.creator	Elizalde, J.
dc.creator	Diez, V.
dc.creator	Arriola, A.
dc.creator	Aranburu, I.
dc.creator	Zarketa, A.
dc.creator	Martinez-Agirre, M.
dc.creator	Martin-Mayor, A.
dc.creator	Bou-Ali, M.M.
dc.date.accessioned	2024-10-25T07:01:24Z
dc.date.available	2024-10-25T07:01:24Z
dc.date.issued	2017-12-21
dc.identifier.citation	Tijero, Eguiluz, Elizalde, Diez, Arriola, Aranburu, Zarketa, Martinez-Agirre, Martin-Mayor, & Bou-Ali. (2017). Vacuum packaging and semipassive chips for wireless temperature monitoring in industrial applications. Proceedings of IEEE Sensors, 2017-December, 1-3. https://doi.org/10.1109/ICSENS.2017.8234235
dc.identifier.uri	https://hdl.handle.net/20.500.11984/6707
dc.description.abstract	This paper describes a smart system to monitor high temperature in industrial applications. The solution includes a semipassive microchip which allows logging data and wireless reading. Protection for the electronics against high temperature environment is provided by a vacuum packaging. Thermal isolation at 150°C and 800°C ambient temperature allows the system to work properly during 14 and 2 minutes respectively.
dc.language.iso	eng
dc.publisher	Institute of Electrical and Electronics Engineers Inc.
dc.rights	closedAccess
dc.title	Vacuum packaging and semipassive chips for wireless temperature monitoring in industrial applications
dc.type	CONFERENCE_PAPER
dc.date.updated	2024-10-25T07:01:24Z

Ficheros en el ítem

Ficheros	Tamaño	Formato	Ver
No hay ficheros asociados a este ítem.