ListarKongresuak-Ingeniaritza por tema "Semiconductor device modeling"
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Analytical Model of the Current Stress in Active-Bridge Active-Clamp Converter for More Electric Aircraft
(IEEE, 2021)Nowadays, the emergence of electrically supplied actuators and energy storage systems is leading the aeronautic industry to develop aircrafts with more electrical power installed. Therefore, different Power-Electronic ... -
Novel Analytical Method for Estimating the Junction-to-Top Thermal Resistance of Power MOSFETs
(IEEE, 2022)This papers proposes a new methodology for estimating the thermal resistance from the junction-to-top capsule surface. By placing the transistor in a vertical position, without being soldered to any PCB, and sensing the ...