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Title
Vacuum packaging and semipassive chips for wireless temperature monitoring in industrial applications
Author
Author (from another institution)
Research Group
Mecánica de fluidos
xmlui.dri2xhtml.METS-1.0.item-contributorOtherinstitution
https://ror.org/03hp1m080
Version
http://purl.org/coar/version/c_ab4af688f83e57aa
Rights
© 2017 IEEE
Access
http://purl.org/coar/access_right/c_abf2
URI
https://hdl.handle.net/20.500.11984/5783
Publisher’s version
Published at
2017 IEEE SENSORS Conference Proceedings  Glasgow. 29 October-1 November, 2017. IEEE, 2017
Keywords
Packaging
Wireless communication
Temperature sensors
Wireless sensor networks ... [+]
Packaging
Wireless communication
Temperature sensors
Wireless sensor networks
temperature measurement
Monitoring
Antennas [-]
Abstract
This paper describes a smart system to monitor high temperature in industrial applications. The solution includes a semipassive microchip which allows logging data and wireless reading. Protection for ... [+]
This paper describes a smart system to monitor high temperature in industrial applications. The solution includes a semipassive microchip which allows logging data and wireless reading. Protection for the electronics against high temperature environment is provided by a vacuum packaging. Thermal isolation at 150°C and 800°C ambient temperature allows the system to work properly during 14 and 2 minutes respectively. [-]
xmlui.dri2xhtml.METS-1.0.item-sponsorship
Gobierno Vasco-Eusko Jaurlaritza
xmlui.dri2xhtml.METS-1.0.item-projectID
info:eu-repo/grantAgreement/GV/Elkartek 2016/KK-2016-00030/CAPV/Microtecnologías como motor de desarrollo de sistemas ciber-físicos avanzados involucrados en la fábrica inteligente/MICRO4FAB
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