2026-04-11T05:21:44Zhttps://ebiltegia.mondragon.edu/oai/request

oai:ebiltegia.mondragon.edu:20.500.11984/59142024-07-12T08:22:47Zcom_20.500.11984_1143col_20.500.11984_1148

Arruti Romero, Asier Aizpuru, Iosu 2022-12-13T14:59:49Z 2022-12-13T14:59:49Z 2022 978-9-0758-1539-9 https://katalogoa.mondragon.edu/janium-bin/janium_login_opac.pl?find&ficha_no=170433 https://hdl.handle.net/20.500.11984/5914 This papers proposes a new methodology for estimating the thermal resistance from the junction-to-top capsule surface. By placing the transistor in a vertical position, without being soldered to any PCB, and sensing the dissipated power and the temperatures of the device, it is possible to characterize the internal thermal resistance. eng © 2022 IEEE Semiconductor device modeling Temperature sensors Thermal resistance Surface resistance surface roughness Thermal analysis Rough surfaces Novel Analytical Method for Estimating the Junction-to-Top Thermal Resistance of Power MOSFETs http://purl.org/coar/resource_type/c_c94f