2026-04-07T14:13:22Zhttps://ebiltegia.mondragon.edu/oai/request

oai:ebiltegia.mondragon.edu:20.500.11984/57832024-03-04T17:09:10Zcom_20.500.11984_1143col_20.500.11984_1148

Vacuum packaging and semipassive chips for wireless temperature monitoring in industrial applications Zarketa-Astigarraga, Ander Martinez Agirre, Manex Martin-Mayor, Alain Bou-Ali, M. Mounir Tijero, M. Aranburu, I. Arriola, A. Díez, V. Elizalde, J. Eguiluz, X. Packaging Wireless communication Temperature sensors Wireless sensor networks temperature measurement Monitoring Antennas This paper describes a smart system to monitor high temperature in industrial applications. The solution includes a semipassive microchip which allows logging data and wireless reading. Protection for the electronics against high temperature environment is provided by a vacuum packaging. Thermal isolation at 150°C and 800°C ambient temperature allows the system to work properly during 14 and 2 minutes respectively. 2022-10-31T09:25:48Z 2022-10-31T09:25:48Z 2017 http://purl.org/coar/resource_type/c_c94f 9781509010127 https://katalogoa.mondragon.edu/janium-bin/janium_login_opac.pl?find&ficha_no=148233 https://hdl.handle.net/20.500.11984/5783 eng © 2017 IEEE