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    • 50 kW Partial Power Converter for EV Charging 

      Anzola, Jon; Arruti Romero, Asier; Aizpuru, Iosu; Agirrezabala, Eneko; Mazuela, Mikel (IEEE, 2024)
      This paper presents the design and assembly of a 50 kW dual active bridge partial power converter. Due to the reduction in the power processed by the converter, the maximum power observed by the converter is set to 4.7 kW. ...
    • Comparative Analysis of TSD and NTC-Based Temperature Measurement for Power Semiconductor Modules 

      Agirrezabala, Eneko; Portillo Cancho, Ane; Lajas Garcia, Miguel; Aizpuru, Iosu; Garrido, David (IEEE, 2025)
      Accurate temperature estimation is essential for ensuring the reliability and performance of power semiconductor devices. This paper presents various techniques used in the industry and focuses on a comparative analysis ...
    • Dynamic Wireless Power Transfer DWPT Time Domain model: xyz position and speed coupling effect 

      Aizpuru, Iosu; Agirrezabala, Eneko; Mazuela, Mikel; IRAOLA, UNAI (IEEE, 2022)
      The paper presents a DWPT system time domain model which considers speed and position (x, y, z) coupling effects. The speed effect compared to static WPT, presents an active behavior that should be considered during the ...
    • Enhancing Overload Capability of Electric Truck Inverters via Active Thermal Control 

      Agirrezabala, Eneko; Pascal, Yoann; Debbadi, Karthik; Liserre, Marco; Aizpuru, Iosu; Garrido, David (IEEE, 2026)
      Electric trucks are subject to demanding overload events during operations such as kerbstone climbing, where the inverter operates at low output frequency and high current, leading to significant thermal stress on power ...
    • Experimental verification of the AC resistance effect in Insulated Metal Substrate based Power Converters 

      Aizpuru, Iosu; Arruti Romero, Asier; Agirrezabala, Eneko; Mazuela, Mikel (IEEE, 2023)
      Insulated Metal Substrate (IMS) based power converters are an excellent solution for thermal dissipation of power converters, but they suffer for limited layer options generating parasitic elements specially in High ...
    • Optimising Power Semiconductor Thermal Simulation via Finite Element Modeling 

      Agirrezabala, Eneko; Oca, Laura; Aizpuru, Iosu; Garrido, David; Baraia-Etxaburu, Igor (IEEE, 2025)
      This article presents a Finite Element Modeling (FEM) framework for thermal analysis of power semiconductor modules, combining simulation accuracy with enhanced computational efficiency. Power losses are calculated using ...

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