• Optimising Power Semiconductor Thermal Simulation via Finite Element Modeling 

      Agirrezabala, Eneko; Oca, Laura; Aizpuru, Iosu; Garrido, David; Baraia-Etxaburu Zubiaurre, Igor (IEEE, 2025)
      This article presents a Finite Element Modeling (FEM) framework for thermal analysis of power semiconductor modules, combining simulation accuracy with enhanced computational efficiency. Power losses are calculated using ...
    • Steady-state temperature calculation tool for multilayer PCBs 

      Gezala Rodero, Haitz; Garrido, David; Baraia-Etxaburu Zubiaurre, Igor; Aizpuru, Iosu; Paniagua Amillano, Julen (IEEE, 2025)
      The adoption of GaN-based devices in power converters offers significant improvements in efficiency and power density, but also intensifies thermal challenges by concentrating heat in smaller volumes. High current and ...
    • Time saving analytical modelling and design of PCBS with through-hole and blind thermal vias 

      Gezala Rodero, Haitz; Garrido Díez, David; Baraia-Etxaburu Zubiaurre, Igor; Aizpuru Larrañaga, Iosu (IET, 2025)
      High-power-density converters concentrate heat in smaller areas of printed circuit boards (PCBs), a challenge exacerbated by Gallium Nitride (GaN)-based components in surface-mount device (SMD) packages. While these ...